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Malaysian Chip Firm SQAI Said to Plan $73 Million IPO in Early 2027
First reported by Bloomberg ·
The signal
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Brief pending · reported by Bloomberg, the single source so far
What happened
Malaysian semiconductor firm SQ Advanced Interconnect Bhd. is considering raising about 300 million ringgit ($73 million) in an initial public offering in the first quarter of 2027, people familiar wi...
Source description shown. AI brief pending.
Funding
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