Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

Your AI hardware will perform better and potentially become more power-efficient, as advanced HBM becomes more available.

Samsung Electronics plans to more than double its output of HBM4 and HBM4E high-bandwidth memory chips next year, aiming to significantly increase the demand for glass carriers by 2.5 times. The company will raise its outsourced glass carrier cleaning volume to 50,000 sheets per month in 2025, up from 20,000 sheets per month in 2024 and 10,000 sheets per month in 2023. This expansion is driven by the growing importance of glass carriers for high-layer stacking in HBM production, especially as Samsung scales up production of 12-layer and higher stacked HBM4 and HBM4E. Overall HBM production is expected to grow to approximately 250,000 wafers per month next year, up from about 180,000 wafers per month this year, with the HBM4 family comprising about 80% of shipments.

Samsung's aggressive expansion in HBM4 and HBM4E production signals a heightened focus on next-generation memory crucial for AI acceleration. The surge in glass carrier demand underscores the critical role of advanced packaging technologies in enabling higher layer counts and improved performance for AI accelerators like those from Nvidia.

This move by Samsung indicates a competitive race to secure supply chains for essential components and to meet the escalating demand from AI chip manufacturers. Investors and competitors will closely watch Samsung's execution and its impact on market share and pricing dynamics in the high-end memory segment.