Singapore’s Nexstrom wants to bring 2D semiconductors to chip fabs

The cost to manufacture advanced chips may eventually fall as 2D materials offer a path beyond silicon scaling.

Singapore-based startup Nexstrom has raised $12 million in seed funding to advance its technology for producing 2D semiconductors. The company aims to overcome the limitations of silicon-based chips, such as leakage and power loss, by using transition-metal dichalcogenides (TMDs), which are atomically thin materials. Nexstrom is developing specialized equipment, called North Star, to grow these TMDs directly on 300mm (12-inch) wafers used in commercial chip manufacturing. While other industry giants like TSMC and Intel are also exploring 2D materials, Nexstrom's focus is on scaling production to meet foundry demands. The company plans to collaborate with or sell its technology to established chipmakers. Nexstrom has already demonstrated material results on its 12-inch system and aims for commercial production readiness between 2030 and 2035, with initial funding totaling $15 million.

Nexstrom's approach of growing TMDs directly on 300mm wafers addresses a critical bottleneck in the adoption of 2D semiconductors for mass production. This directly tackles the challenge of achieving consistent material quality at scale, a hurdle that has limited laboratory successes from transitioning to industrial application. By focusing on the equipment and process for wafer-level integration, Nexstrom positions itself as a key enabler for future chip architectures that demand these advanced materials.

The success of Nexstrom's technology could signal a significant shift in the semiconductor manufacturing landscape, potentially reducing reliance on traditional silicon processes and the associated physical limitations. If Nexstrom can deliver on its promise, it might unlock new avenues for chip performance and power efficiency, impacting the design and capabilities of everything from consumer electronics to data center hardware. The industry will be watching to see if its scalability claims hold up against the rigorous demands of commercial chip fabrication.