TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal

The US is building critical semiconductor manufacturing capacity for AI hardware.

TSMC and GlobalFoundries have entered a $2 billion, multi-year partnership to increase US-based production of silicon interposers. GlobalFoundries will manufacture these critical components for TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology at its Malta, New York facility. Silicon interposers are vital for advanced semiconductor assemblies like GPUs and AI accelerators, enabling faster, lower-power communication between multiple chip dies compared to traditional organic packaging. This collaboration aims to address a significant bottleneck in the US semiconductor supply chain, as many advanced chips, including those for AI datacenters, currently require final assembly in Taiwan. GlobalFoundries plans to expand its Malta plant's capacity, with volume production expected by the first half of 2028, a timeline that aligns with TSMC's own US facility expansion which is not anticipated to be operational until 2028-2029.

This partnership signals a concerted effort to onshore advanced packaging capabilities, a key chokepoint in the domestic production of high-performance chips essential for AI and HPC workloads. By securing a US-based source for silicon interposers, TSMC and GlobalFoundries are attempting to reduce reliance on overseas facilities and shorten lead times for critical components. The agreement highlights the strategic importance of advanced packaging in the semiconductor supply chain, moving beyond traditional wafer fabrication to enable next-generation computing power.

The deal will directly impact companies designing and deploying AI accelerators and GPUs that utilize CoWoS packaging, potentially offering more stable and secure supply lines for US-based customers. While GlobalFoundries' capacity won't be fully online until 2028, the announcement provides a clearer roadmap for US-centric advanced packaging, potentially influencing future chip designs and supply chain strategies. This move could also spur further investment and competition in the US advanced packaging sector, as Intel Foundry also offers comparable technologies.