CTS: Chinese logic and memory chipmakers accumulated 343 ASML immersion DUV lithography scanners between 2012 and early 2026, many of which can make 7nm chips

Your ability to buy or sell advanced chips could be impacted by China's enhanced domestic fabrication capabilities.

Chinese chipmakers have acquired 343 immersion deep ultraviolet (DUV) lithography tools from ASML between 2012 and early 2026, according to a report by the Centre for Technology & Statecraft (CTS). The report estimates that 270 of these scanners are capable of producing chips at 7nm-class process technologies, a capability previously thought to require more advanced extreme ultraviolet (EUV) systems. This significant accumulation of advanced DUV equipment allows Chinese fabs to develop sophisticated processors despite facing sanctions that restrict access to ASML's latest EUV machines. The report notes that existing export controls may have a loophole, as equipment initially intended for less advanced nodes could be repurposed for 7nm production, albeit at an increased cost. Chinese manufacturers have been aggressively acquiring fabrication equipment amidst ongoing U.S. restrictions on its semiconductor industry.

The stockpiling of 343 immersion DUV lithography tools, with a significant portion capable of 7nm production, indicates a strategic move by China to bolster its domestic semiconductor manufacturing capacity despite international restrictions. This development challenges the perceived efficacy of current export controls, suggesting a potential pathway for China to achieve greater self-sufficiency in advanced chip production. The repurposing of older DUV technology for more sophisticated nodes highlights the adaptability and resilience of China's chip industry in navigating geopolitical pressures.

This situation signals a potential shift in the global semiconductor supply chain, where China's enhanced domestic capabilities could reduce reliance on foreign foundries and influence market dynamics. Companies and nations that depend on advanced chip access may need to reassess their strategies and consider the implications of a more robust Chinese domestic supply. Future developments to watch include the actual yield and performance of chips produced using these repurposed DUV tools and potential further regulatory responses to address this technological advancement.