CTS: Chinese logic and memory chipmakers have imported 343 ASML immersion DUV lithography scanners from 2012 to early 2026, many of which can make 7nm chips

China can now produce 7nm chips using older ASML machines, bypassing EUV restrictions.

Chinese chip manufacturers have reportedly acquired 343 ASML immersion DUV lithography scanners between 2012 and early 2026. A report by the Centre for Technology & Statecraft (CTS) suggests that a significant portion of these machines, estimated at 270 units, are capable of producing chips at 7nm-class process technology nodes. This procurement is notable because it allows Chinese fabs to manufacture advanced processors despite restrictions on acquiring ASML's more advanced Extreme Ultraviolet (EUV) lithography systems. The report indicates that China has been actively stockpiling this equipment, particularly as U.S. export controls have tightened on its semiconductor industry. The CTS asserts that existing export regulations have a loophole, as lithography tools initially intended for older manufacturing processes can be repurposed for newer, more sophisticated ones like 7nm, albeit at an increased operational cost.

This situation highlights a critical vulnerability in current export controls designed to limit China's access to advanced semiconductor manufacturing capabilities. By repurposing existing immersion DUV tools for 7nm production, Chinese chipmakers are effectively circumventing the intent of sanctions that target their ability to produce cutting-edge processors. The ability to achieve 7nm class nodes without EUV technology signifies a substantial leap in domestic chipmaking capacity, potentially impacting global supply chains and geopolitical technological competition.

The implications extend to companies reliant on advanced chip supply and governments enforcing export bans. It suggests that the market for refurbished or re-purposed equipment can become a significant factor in technological proliferation. Future policy discussions will likely need to address this adaptive capacity, potentially requiring stricter oversight on the utilization of existing advanced equipment within sanctioned countries and a reevaluation of what constitutes 'advanced' technology in the context of lithography.